Open AccessAdvances in 3D Memory and Logic Devices
Author(s) -
Robert Patti
Publication year - 2010
Publication title -
additional conferences (device packaging hitec hiten and cicmt)
Language(s) - English
Resource type - Journals
ISSN - 2380-4491
DOI - 10.4071/2010dpc-ta13
Subject(s) - computer science , dram , computer architecture , computer hardware
Tezzaron is continuing to push the level of 3D integration. The latest results of a new 1-4Gb 3D DRAM will be presented along with the plans (and possibly some results) of further integration with other 3D host logic devices. Additionally, results from several other recent 3D integrations will be reviewed.
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