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Enhancement of thermal and insulation properties of αAl2O3/PAI hybrid materials prepared by surface-modified α-Al2O3
Author(s) -
Ho Seong Na,
Dae Su Jung,
Dae Sung Kim,
Dong Kyu Roh,
Deug Joong Kim,
Hyung Mi Lim,
Seungho Lee
Publication year - 2019
Publication title -
journal of ceramic processing research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.203
H-Index - 30
eISSN - 2672-152X
pISSN - 1229-9162
DOI - 10.36410/jcpr.2019.20..92
Subject(s) - materials science , composite material , thermal insulation , thermal , surface modification , chemical engineering , layer (electronics) , physics , meteorology , engineering
To improve α-Al2O3 dispersion and increase the possible interaction between α-Al2O3 and a polyamideimide (PAI) matrix, the α-Al2O3 surface was modified with different amounts of a silane coupling agent, N-phenyl-(3-aminoproyl)trimethoxy silane (NAPTMS). Surface-modified α-Al2O3 was successfully functionalized with N-APTMS through a binary solvent system. To confirm and modify the amount of silane precisely, the OH site density on α-Al2O was measured through acid-base titration as 1.001, 2.537, and 0.980 OH/nm for pristine (A-O), ball-milled (A-M), and surface-modified (A-SM-100) α-Al2O3, respectively. The surface-modified α-Al2O3 was dispersed in N-methyl-2-pyrrolidone (NMP) and the solutions were fully mixed in PAI resin. The A-SM/PAI were coated on Cu plate and thermally cured. The thermal conductivity and dielectric breakdown strength of A-SM/PAI film on Cu plate were greater than those of pristine PAI or pristine hybrid material.

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