Open AccessInfluence of Substrate Surface States on Interface Bonding Quality for Bonding Joints Manufactured by Hot-compression Bonding
Author(s) -
Jun Guo,
Yong Zhao,
Zhuji Jin,
Qinqiang Wang,
Jian Feng,
Xiuru Li
Publication year - 2021
Language(s) - English
Resource type - Conference proceedings
DOI - 10.3390/micromachines2021-09562
Subject(s) - materials science , anodic bonding , interface (matter) , quality (philosophy) , composite material , bonding strength , direct bonding , substrate (aquarium) , silicon , optoelectronics , layer (electronics) , wetting , philosophy , oceanography , epistemology , sessile drop technique , geology