Open AccessSimulation of multi-layer TiN/TiAlN thin film growth and calculation of its thermal conductivity
Author(s) -
Pavel Moskovkin,
Jérôme Müller,
Stéphane Lucas
Publication year - 2020
Language(s) - English
Resource type - Conference proceedings
DOI - 10.3390/asec2020-07733
Subject(s) - thermal conductivity , materials science , tin , titanium nitride , nitride , titanium , aluminium , layer (electronics) , composite material , electrical resistivity and conductivity , stack (abstract data type) , titanium alloy , thermal conductivity measurement , metallurgy , alloy , electrical engineering , computer science , programming language , engineering