The Impact of Active Cooling on Heat Resistant PLA | Zendy

Norbert László Lukács | Zendy; Péter Ficzere | Zendy; Gábor Szebényi | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

The Impact of Active Cooling on Heat Resistant PLA

Author(s) -

Norbert László Lukács,

Péter Ficzere,

Gábor Szebényi

Publication year - 2020

Publication title -

műszaki tudományos közlemények

Language(s) - English

Resource type - Journals

ISSN - 2601-5773

DOI - 10.33894/mtk-2020.13.21

Subject(s) - ultimate tensile strength , materials science , heat resistance , manufacturing process , process engineering , process (computing) , composite material , mechanical engineering , computer science , engineering , operating system

In this study the properties of HT-PLA were determined with tensile tests. The influence of cooling was determined and influence of manufacturing environment shown to be predictable. Heat resistant 3D printing materials can be widely used in the manufacturing process but these materials are relatively expensive. HTPLA is one of the cheapest materials with these parameters.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research