Heat Pump Integration by Pinch Analysis for Industrial Applications: A Review | Zendy

Florian Schlosser | Zendy; Cordin Arpagaus | Zendy; Timothy Gordon Walmsley | Zendy

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Heat Pump Integration by Pinch Analysis for Industrial Applications: A Review

Author(s) -

Florian Schlosser,

Cordin Arpagaus,

Timothy Gordon Walmsley

Publication year - 2019

Publication title -

chemical engineering transactions

Language(s) - English

Resource type - Journals

ISSN - 1974-9791

DOI - 10.3303/cet1976002

Subject(s) - pinch analysis , process integration , heat pump , coefficient of performance , process engineering , mechanical engineering , system integration , process (computing) , environmental science , computer science , engineering , heat exchanger , operating system

The aim of this paper is to review energy-efficient integration applications of vapour-compression heat pumps for various industries and processes based on the Grand Composite Curve (GCC) and to demonstrate its savings potential. A method was applied to directly deduce the integration parameters from the GCC by Coefficient of Performance (COP) curves. This approach has been applied to various case study data. Typical integration concepts are presented graphically and evaluated quantitatively using the COP. For a system efficient application, the heat pump must be integrated across the pinch. In particular, the food, paper, electroplating, metalworking and chemical industries are suited for heat pump integration with their unit operations of cooling, bathing and process heating, domestic hot water (DHW), drying and space heating. Their integration concepts show COPs from 2.2 to 5.8 with temperature lifts from 32.5 to 102 K and cover 23 to 100 % of the process heat demand and 28 to 82 % of the cooling demand.

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