Modeling tools and prototype design of loop heat pipe for electronics cooling

LHPs are promising two-phase thermal transport devices for electronics cooling. The developed modeling tools include a system level model, criteria of selecting working fluids, and individual component models for modularized design of LHP condenser and evaporator. Based on these tools, new figures of merit for measuring capillary limit and heat leak effects are defined, the condensation pressure drop is shown to be always dominating the loop pressure drop in air-cooled LHPs, and a published LHP prototype for laptop computer cooling is simulated. The modeling results agree well with the available experimental data and reveal that the air flow is the bottleneck of this prototype.