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ENCAPSULATED THERMIONIC ENERGY CONVERTER WITH STIFFENED SUSPENSION
Author(s) -
J.H. Lee,
Igor Bargatin,
Kentaro Iwami,
Karl A. Littau,
Maxime Vincent,
Roya Maboudian,
ZhiXun Shen,
Nicholas A. Melosh,
Roger T. Howe
Publication year - 2012
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2012.130
Subject(s) - common emitter , materials science , thermionic emission , wafer , optoelectronics , suspension (topology) , oxide , planar , work function , composite material , layer (electronics) , metallurgy , physics , mathematics , computer graphics (images) , quantum mechanics , homotopy , computer science , pure mathematics , electron
This paper reports a prototype of a mechanically and thermally robust encapsulated microfabricated thermionic energy converter (μ-TEC). We used conformal sidewall deposition of poly-SiC to form stiff suspension legs with U-shaped cross sections, which increase the out-of-plane rigidity and prevent contact with the substrate during the heating of the suspended emitter—a qualitative improvement over the previously reported planar SiC μ-TECs [1]. Furthermore, we tested the new μ-TECs with both barium and barium oxide coatings. The coatings reduced the work function of the SiC emitter to as low as ~2.14 eV and increased the thermionic current by 5-6 orders of magnitude, which is a key step toward realizing a highly efficient thermionic energy converter. In addition, we have sealed small arrays of μ-TECs using an anodically bonded pyrex wafer.

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