Open AccessApplication of Micromachining Technology to Lateral Field Emission Devices
Author(s) -
V. Milanović,
Lance Doherty,
Dana Teasdale,
C. Zhang,
S. Parsa,
Kristofer S. J. Pister
Publication year - 2000
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.79
Subject(s) - surface micromachining , deep reactive ion etching , microelectromechanical systems , materials science , bulk micromachining , optoelectronics , electrode , substrate (aquarium) , microfabrication , actuator , field electron emission , etching (microfabrication) , fabrication , nanotechnology , electrical engineering , reactive ion etching , engineering , alternative medicine , pathology , quantum mechanics , electron , medicine , physics , chemistry , oceanography , layer (electronics) , geology
We demonstrate a range of novel applications of micromachining and microelectromechanical systems (MEMS) in achieving efficient and tunable field emission devices (FEDs), and in improving their ease of integration. In each case, arrays of lateral field emission tips are fabricated with submicron spacing utilizing deep reactive ion etch (DRIE). Tip density of over 150⋅10 tips/cm can be achieved, and current of over 150 A/cm. By utilizing sacrificial sidewall spacing, electrodes can be placed at arbitrarily close distances. We further utilize MEMS actuators to laterally adjust electrode distances. To improve integration capability of the FEDs, we demonstrate batch bumptransfer integration of working FEDs onto a quartz target substrate.
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