Thermal Residual Stresses Analyses of Two-Dimensional Functionally Graded Circular Plates with Temperature-Dependent Material Properties

In this study, thermal residual stress analysis of Functionally Graded Circular Plates joined with adhesive (FGCP-A) is presented. Finite difference equations are used in solving Navier’s equations of elasticity and heat transfer. The grading along the plate is made along the surface of the plate. Material properties of the plate are investigated depending on the temperature dependent/independent and it is assumed that the temperature independent material properties changed according to the MoriTanaka approach. Grading along the plate is made in both radial and angular directions. In this study, the effects of temperature dependent/independent material properties and compositional gradient exponents on temperature, equivalent strain and equivalent stress are compared. As a result, when considering the properties of the material depending on the temperature, the temperature, equivalent stress and strain distributions and levels vary considerably. Therefore, the properties of the material dependent on the temperature must be taken into consideration in the analysis of thermal residual stress of materials used as high temperature material.