AMELIORATING THE PERFORMANCE OF A PLANAR INVERTED F ANTENNA BY MINIMIZATION OF LOSSES

This paper aims at designing a wideband planar inverted F antenna (PIFA). The design of a PIFA begins with an elementary step such as the etching of antenna element pattern in a metal trace. After the etching adherence is developed by incorporating bonding between it and a printed circuit board which is primarily an insulating dielectric substrate. A ground plane is developed by a prolonging metallic layer which is adhered to the opposite side of the substrate. The simulation is done using ANSYS HFSS full wave 3D simulation software. The proposed PIFA is very compact and also provides a gain of 2.86 dB. As a consequence of the exemplary feature like an omnidirectional radiation pattern, there is an exceptional improvement in coverage. Moreover, the frequency bands covered by the PIFA are for applications including USPCS, UMTS, ISM/ Bluetooth and WLAN at (1.85 to 1.99)GHz, (1.90 to 2.20)GHz, (2.4 to 2.485)GHz and (5.1 to 5.90)GHz, respectively.