EMC COMPUTER MODELLING AND SIMULATION OF INTEGRATED CIRCUITS IN QFN PACKAGE | Zendy

Haiyan Sun | Zendy; Boyuan Zhu | Zendy; Ling Ling Sun | Zendy; Hengxu Li | Zendy; LingLing Yang | Zendy

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EMC COMPUTER MODELLING AND SIMULATION OF INTEGRATED CIRCUITS IN QFN PACKAGE

Author(s) -

Haiyan Sun,

Boyuan Zhu,

Ling Ling Sun,

Hengxu Li,

LingLing Yang

Publication year - 2013

Publication title -

progress in electromagnetics research m

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.35

H-Index - 40

ISSN - 1937-8726

DOI - 10.2528/pierm13082802

Subject(s) - quad flat no leads package , computer science , electronic circuit , electrical engineering , engineering , materials science , nanotechnology , adhesive , layer (electronics)

This paper discusses the application of computational electromagnetics (CEM) for electromagnetic compatibility (EMC) problems of integrated circuits (ICs). It is known that the application of CEM is versatile in solving a wide range of problems. This paper focuses on the electromagnetic study of quad flat non-lead (QFN) packaged ICs, one monolithic microwave integrated circuit (MMIC) and another radio frequency integrated circuit (RFIC), from the individual chip to system in package (SiP). Full-wave electromagnetic technique is conducted in the modelling and simulation. Both chips are found producing radiated emissions in horizontal directions as omnidirectional antennas at working frequencies and then directional at resonance frequencies.Full Tex

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