Open AccessSURFACE-MOUNT PIFA USING BALL GRID ARRAY PACKAGING FOR 5G MMWAVE
Author(s) -
Xi Wang,
Xiubo Liu,
Wei Zhang,
Dongning Hao,
Yanyan Liu
Publication year - 2021
Publication title -
progress in electromagnetics research letters
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.245
H-Index - 33
ISSN - 1937-6480
DOI - 10.2528/pierl21050203
Subject(s) - mount , ball grid array , ball (mathematics) , surface mount technology , grid , materials science , computer science , printed circuit board , geology , composite material , operating system , geodesy , geometry , mathematics , soldering
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