STUDY OF THE COIL STRUCTURE FOR WIRELESS CHIP-TO-CHIP COMMUNICATION APPLICATIONS

In this work, we propose a merged coil structure for wireless chip-to-chip communication technology. Using the proposed coil structure, the chip size can be reduced, and the transmitted power can be improved by approximately 5dB compared to typical coil structure. To verify the feasibility of the coil, an electromagnetic simulation and a schematic simulation are performed. The coil was implemented using 50-nm digital CMOS technology. From the experimental results, the feasibility was proved.