EMPIRICAL MIXING MODEL FOR THE ELECTROMAGNETIC MODELLING OF ON-CHIP INTERCONNECTS

We present an empirical mixing model for rectangular cuboid metal inclusions in a host dielectric, suitable for replacing the detailed structure of a layer of on-chip interconnects with a homogeneous dielectric slab. Such an approximation is required to facilitate the accurate and e-cient package-level electromagnetic modelling of complicated miniaturised systems, such as System-in- Package. Without such an approach, the direct inclusion of large areas of on-chip interconnect structures often results in intractable computation times. Our model allows us to predict the re∞ection (transmission) coe-cient of impinging plane waves to within 3.5% (0.2%) error for incident angles up to 30 - ofi-normal, aspect ratios 0.6{3, metal flll factors 0.3{0.6, and host dielectric constants 1{11.7, over the frequency range 1{10GHz.