DESIGN OF SINGLE PIN SHORTED THREE-DIELECTRIC-LAYERED SUBSTRATES RECTANGULAR PATCH MICROSTRIP ANTENNA FOR COMMUNICATION SYSTEMS | Zendy

Aditi Thakur | Zendy; Ghanshyam Singh | Zendy

Open Access

DESIGN OF SINGLE PIN SHORTED THREE-DIELECTRIC-LAYERED SUBSTRATES RECTANGULAR PATCH MICROSTRIP ANTENNA FOR COMMUNICATION SYSTEMS

Author(s) -

Aditi Thakur,

Ghanshyam Singh

Publication year - 2008

Publication title -

progress in electromagnetics research letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.245

H-Index - 33

ISSN - 1937-6480

DOI - 10.2528/pierl08010703

Subject(s) - microstrip antenna , patch antenna , microstrip , dielectric , materials science , antenna (radio) , acoustics , optoelectronics , electronic engineering , electrical engineering , telecommunications , computer science , engineering , physics

In this paper, we have simulated a single-pin-shorted microstrip line fed three-dielectric-layer (with different permittivity and thickness) rectangular patch microstrip antenna for all those communication systems whose limited antenna size is premium. Low permittivity hard foam has been used as one substrate to achieve wide bandwidth. The simulation of this proposed antenna has been performed by using CST Microwave Studio, which is a commercially available electromagnetic simulator based on the finite difference time domain technique.

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