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A new structure design of a multi-band suspended stepped slot microstrip patch antenna with copper ground plane for future mobile communications is proposed and presented. A parametric study for the effect on the proposed antenna is done on a par with the integration of a polycrystalline silicon solar cell. The compact low profile proposed antenna is developed using Printed Circuit Board (PCB) technology on a substrate, FR4 with physical size of 50 × 50 mm2. Simulated and measured results are presented to validate the usefulness of the proposed antenna structure for Wi-Max and future mobile communications. The measured result reveals that the presented stepped slot patch antenna with copper ground plane offers impedance bandwidth of 3.94% (covering 5.46 GHz–5.68 GHz band), 3.06% (covering 7.08 GHz–7.3 GHz band), and 9.26% (covering 8.34 GHz–9.15 GHz band). The same radiating patch with solar ground plane offers impedance bandwidth of 4.58% (covering 5.12 GHz– 5.36 GHz band) and 3.06% (covering 7.32 GHz–8.02 GHz band) for future mobile communications. Good VSWR and radiation pattern characteristics are obtained in the frequency band of interest.

STEPPED SLOT PATCH ANTENNA WITH COPPER GROUND PLANE AND SOLAR CELL GROUND PLANE FOR FUTURE MOBILE COMMUNICATIONS