Open AccessMETHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING
Author(s) -
Boping Wu,
Hungying Louis Lo
Publication year - 2012
Publication title -
electromagnetic waves
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 89
eISSN - 1559-8985
pISSN - 1070-4698
DOI - 10.2528/pier11110503
Subject(s) - signal integrity , power integrity , stacking , miniaturization , computer science , signal (programming language) , package on package , structural integrity , package design , electronic engineering , system in package , interconnection , engineering , electrical engineering , engineering drawing , telecommunications , structural engineering , wafer dicing , chip , physics , nuclear magnetic resonance , wafer , programming language
Design of high performance package interconnects using full-wave electromagnetic solvers is necessary due to increased operation speed, miniaturization and vertical 3D integration. Thus the segmented study and optimization is becoming inevitable for designers to improve the signal integrity of IC packaging. This paper addresses alternative methods and optimal designs on several components and structures for package electrical interconnects, including voiding technique, padless via implementation, spiral micro-via stacking and signal/ground layout pin patterns. The simulation results have been presented to demonstrate the improvements of optimized schemes. These methodologies could be treated as handy references and general guidelines applicable to difierent package designs and could result in signiflcant improvements of overall package signal integrity performance.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom