IMPEDANCE MATCHING CAPABILITY OF NOVEL SOCKET CONTACTOR DESIGN USING VARIABLE OPEN STUBFOR RF PACKAGING TESTING | Zendy

Sung-Mao Wu | Zendy; Kao-Yi Wang | Zendy; Chuan-Hau Liu | Zendy

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IMPEDANCE MATCHING CAPABILITY OF NOVEL SOCKET CONTACTOR DESIGN USING VARIABLE OPEN STUBFOR RF PACKAGING TESTING

Author(s) -

Sung-Mao Wu,

Kao-Yi Wang,

Chuan-Hau Liu

Publication year - 2011

Publication title -

electromagnetic waves

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.437

H-Index - 89

eISSN - 1559-8985

pISSN - 1070-4698

DOI - 10.2528/pier10121501

Subject(s) - contactor , rlc circuit , electrical impedance , printed circuit board , stub (electronics) , electronic engineering , transmission line , impedance matching , computer science , test data , engineering , electrical engineering , power (physics) , physics , quantum mechanics , voltage , programming language , capacitor

In this paper, we will propose a new structure for a socket contactor applied to the lead-frame test board. This structure contains a variable open stub to match the impedance of the package and the load board. Its electrical property is considered superior to a conventional spring probe's, especially when it is applied to a QFP device. We will present its equivalent model and discuss this in detail. Note that the transmission line model we use is at this point a substitute for a physical structure. First, its RLC model will be constructed after we demonstrate its simulation and test data. Finally, we will use the MonteCarlo Method to analyze length inaccuracies in manufacturing and observe how this new structure works.

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