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Heat Sponge: A Concept for Mass-Efficient Heat Storage
Author(s) -
Scott Splinter,
Max L. Blosser,
Andrew R. Gifford
Publication year - 2008
Publication title -
45th aiaa aerospace sciences meeting and exhibit
Language(s) - English
Resource type - Conference proceedings
DOI - 10.2514/6.2008-1195
Subject(s) - thermal energy storage , sponge , computer science , process engineering , thermodynamics , engineering , geology , physics , paleontology
The heat sponge is a device for mass-efficient storage of heat. It was developed to be incorporated in the substructure of a re-entry vehicle to reduce thermal- protection-system requirements. The heat sponge consists of a liquid/vapor mixture contained within a number of miniature pressure vessels that can be embedded within a variety of different types of structures. As temperature is increased, pressure in the miniature pressure vessels also increases so that heat absorbed through vaporization of the liquid is spread over a relatively large temperature range. Using water as a working fluid, the heat-storage capacity of the liquid/vapor mixture is many times higher than that of typical structural materials and is well above that of common phase change materials over a temperature range of 200 F to 700 F. The use of pure ammonia as the working fluid provides a range of application between 432 deg R and 730 deg R, or the use of the more practical water-ammonia solution provides a range of application between 432 deg R and 1160 deg R or in between that of water and pure ammonia. Prototype heat sponges were fabricated and characterized. These heat sponges consisted of 1.0-inch-diameter, hollow, stainless-steel spheres with a wall thickness of 0.020 inches which had varying percentages of their interior volumes filled with water and a water-ammonia solution. An apparatus to measure the heat stored in these prototype heat sponges was designed, fabricated, and verified. The heat-storage capacity calculated from measured temperature histories is compared to numerical predictions.

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