Multi Objective Optimization of Laminar Mixed Convective Heat Transfer of Electronic Chips in A Horizontal channel with Vortex Generator

This paper represents laminar mixed convective heat transfer in a channel (horizontal) including five electronic chips mounted on the bottom wall with a vortex generator (triangular bar), VG and is carried out in order to maximize heat transfer rate numerically. The effect of position of vortex in horizontal and vertical distance (0.3 0.4) of VG on heat transfer has been investigated thoroughly to observe the dependence of heat transfer on both. The finite volume method and the SIMPLE algorithm are used to solve the conservation equations of mass, momentum, and energy for mixed convection. The Reynolds number changes from 50 to 250. Numerical simulations demonstrate inclusion of vortex generator and results in the substantial enhancement in heat transfer in terms of Nusselt number, Nu, as compared to without vortex generator. The results obtained also show that the Reynolds number and the position of vortex in horizontal and vertical have considerable effects on the improvement of the heat transfer inside the channel. Box Behnken design was used to study the interaction between the parameters which influences the Nusselt number. Highest Nusselt number 16.08 was observed for x/H, y/H and Re at 8.5, 0.4 and 250 respectively. A significant interaction was observed between x/H, h/H with Re.