Open AccessNumerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal
Author(s) -
Yukinobu Natsume,
Kenichi Ohsasa,
Yoshinori Tayu,
Tadashi Momono,
Toshio Narita
Publication year - 2003
Publication title -
isij international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.753
H-Index - 111
eISSN - 1347-5460
pISSN - 0915-1559
DOI - 10.2355/isijinternational.43.1976
Subject(s) - transient (computer programming) , materials science , diffusion , filler (materials) , liquid phase , phase (matter) , composite material , metal , liquid metal , process (computing) , copper , diffusion process , metallurgy , thermodynamics , chemistry , computer science , knowledge management , physics , innovation diffusion , organic chemistry , operating system