Open AccessEffects of Fe, Ni and Sn on Reaction Diffusion at the Solder/Cu-Base Alloy Interface
Author(s) -
Masanori Inaba,
Yoshio Honma,
Koichi Teshima,
Osamu Hirao,
Toshiharu Sakurai
Publication year - 1987
Publication title -
transactions of the japan institute of metals
Language(s) - English
Resource type - Journals
eISSN - 2432-4701
pISSN - 0021-4434
DOI - 10.2320/matertrans1960.28.213
Subject(s) - intermetallic , materials science , alloy , soldering , diffusion , phase (matter) , electron microprobe , metallurgy , copper , base (topology) , thermodynamics , chemistry , organic chemistry , mathematical analysis , physics , mathematics