Open AccessCopper-Reductant Composite for Long-Life Electrical Contact
Author(s) -
Toshihiro Miyake
Publication year - 2015
Publication title -
journal of the japan institute of metals and materials
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.204
H-Index - 29
eISSN - 1880-6880
pISSN - 0021-4876
DOI - 10.2320/jinstmet.j2015039
Subject(s) - ascorbic acid , copper , composite number , aqueous solution , electrical contacts , copper plating , plating (geology) , materials science , oxide , chemistry , reducing agent , metallurgy , chemical engineering , inorganic chemistry , composite material , layer (electronics) , organic chemistry , electroplating , food science , geophysics , engineering , geology
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