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Effect of Substrate Treatment for Fracture Behavior of TiN Film during Three-Point Bending Test
Author(s) -
Yusuke Ushiro,
Daisuke Okai,
Atsushi Yamamoto,
Yutaka Fukushima,
Yoshikazu Taniguchi,
Kiyoshi Matsunaga
Publication year - 2014
Publication title -
journal of the japan institute of metals and materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.204
H-Index - 29
eISSN - 1880-6880
pISSN - 0021-4876
DOI - 10.2320/jinstmet.j2014008
Subject(s) - tin , materials science , bending , delamination (geology) , layer (electronics) , composite material , substrate (aquarium) , nitride , three point flexural test , titanium nitride , metallurgy , paleontology , oceanography , biology , subduction , tectonics , geology

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