Open AccessTransient and cyclic effects on a PCM-cooled mobile device
Author(s) -
C.P. Tso,
F.L. Tan,
Jaljalalul Abedin Jony
Publication year - 2013
Publication title -
thermal science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.339
H-Index - 43
eISSN - 2334-7163
pISSN - 0354-9836
DOI - 10.2298/tsci121206112t
Subject(s) - handset , heat sink , materials science , phase change material , transient (computer programming) , nuclear engineering , mechanics , dissipation , thermodynamics , phase change , electrical engineering , computer science , physics , engineering , operating system
A mock handset with heat storage unit (HSU) has been designed, fabricated, and experimented under various conditions to examine the effect of external heat sink on the handset’s transient temperature distribution, performance of the individual HSU under different power level and orientation, as well as under the more realistic cyclic heating. The cooling of the handset is through using a phase change material (PCM), n-eicosane, stored in the external HSU connected to the handset through a miniature heat pipe. The heat pipe channels the internal heat dissipation to the HSU where it is absorbed by the PCM. Results show that the temperature is significantly lowered with the PCM-based HSU
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