Analytical thermal modelling of multilayered active embedded chips into high density electronic board | Zendy

Eric Monier-Vinard | Zendy; Najib Laraqi | Zendy; Cheikh Tidiane Dia | Zendy; Minh Nhat Nguyen | Zendy; Valentin Bissuel | Zendy

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Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Author(s) -

Eric Monier-Vinard,

Najib Laraqi,

Cheikh Tidiane Dia,

Minh Nhat Nguyen,

Valentin Bissuel

Publication year - 2013

Publication title -

thermal science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.339

H-Index - 43

eISSN - 2334-7163

pISSN - 0354-9836

DOI - 10.2298/tsci120826072m

Subject(s) - miniaturization , thermal management of electronic devices and systems , printed circuit board , electronics , thermal , electronic component , stacking , materials science , chip , dissipation , mechanical engineering , substrate (aquarium) , electronic packaging , computer science , electronic engineering , nanotechnology , electrical engineering , engineering , composite material , telecommunications , physics , oceanography , nuclear magnetic resonance , geology , meteorology , thermodynamics , operating system

The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads

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