Experimental analysis of parallel plate and crosscut pin fin heat sinks for electronic cooling applications | Zendy

Sivasankaran Harish | Zendy; Lazarus Godson Asirvatham | Zendy; Jefferson Raja Bose | Zendy; Bensely Albert | Zendy

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Experimental analysis of parallel plate and crosscut pin fin heat sinks for electronic cooling applications

Author(s) -

Sivasankaran Harish,

Lazarus Godson Asirvatham,

Jefferson Raja Bose,

Bensely Albert

Publication year - 2010

Publication title -

thermal science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.339

H-Index - 43

eISSN - 2334-7163

pISSN - 0354-9836

DOI - 10.2298/tsci1001147s

Subject(s) - heat sink , fin , materials science , heat transfer coefficient , heat transfer , thermal , mechanics , thermodynamics , composite material , physics

Experimental investigation of parallel plate fin and the crosscut pin fin heat sinks where the heating element placed asymmetrically is performed. Theoretical calculations were done and compared with the experimental results. A comparative study was made based on their efficiencies, heat transfer coefficient, and the thermal performance. From the experimental results it was found that the average heat transfer coefficient of parallel plate fins is higher than that of crosscut pin fins with many perforations. However the performance efficiency of both the crosscut pin fins and parallel plate fins is similar. A hybrid approach was employed to significantly optimize the distance between the fan and heat sink for parallel plate and crosscut pin fins. Parallel plate heat sink with an average heat transfer coefficient of 46 W/m²K placed at an optimum fan distance of 40-60 mm is selected as the suitable choice for the micro-electronic cooling when the heating element is placed asymmetrically.

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