Thermal conductivity of pressureless sintered silicon nitride materials with LiYO2 additive | Zendy

Branko Matović | Zendy; Georg Rixecker | Zendy; J. Golczewski | Zendy; Fritz Aldinger | Zendy

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Thermal conductivity of pressureless sintered silicon nitride materials with LiYO2 additive

Author(s) -

Branko Matović,

Georg Rixecker,

J. Golczewski,

Fritz Aldinger

Publication year - 2004

Publication title -

science of sintering

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.309

H-Index - 25

eISSN - 1820-7413

pISSN - 0350-820X

DOI - 10.2298/sos0401003m

Subject(s) - materials science , sintering , thermal conductivity , silicon nitride , ceramic , microstructure , phase (matter) , grain size , composite material , pressureless sintering , conductivity , intergranular corrosion , silicon , metallurgy , chemistry , organic chemistry

Si3N4 ceramics with different microstructures were prepared by pressureless sintering, using LiYO2 as a sintering additive. The effect of micro structural parameters, such as grain size and volume of intergranular phase on thermal conductivity was studied. Materials with thermal conductivities of 26-38 W×(m×K)-1 were obtained by changing the amount of sintering additive. The highest conductivity was measured for the material with the least amount of additive. Since the phase composition is the same for all sintered materials the difference in thermal conductivity is attributed to the amount of glassy phase in the grain-junctions.

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