The estimation of solid copper surface tension in copper sulfate solutions | Zendy

Konstantin Popov | Zendy; Nebojša D. Nikolić | Zendy; Zlatko Rakočević | Zendy

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The estimation of solid copper surface tension in copper sulfate solutions

Author(s) -

Konstantin Popov,

Nebojša D. Nikolić,

Zlatko Rakočević

Publication year - 2002

Publication title -

journal of the serbian chemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.227

H-Index - 45

eISSN - 1820-7421

pISSN - 0352-5139

DOI - 10.2298/jsc0211769p

Subject(s) - overpotential , copper , deposition (geology) , current density , diffusion , surface tension , limiting current , chemistry , sulfate , surface diffusion , limiting , materials science , inorganic chemistry , metallurgy , thermodynamics , electrochemistry , electrode , paleontology , physics , quantum mechanics , adsorption , sediment , biology , mechanical engineering , engineering

In metal electrodeposition in the limiting diffusion current density range, the deposition current density remains constant regardless of the deposition overpotential used. At the same time, the larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increased specific surface. The difference in the specific surface of disperse deposits obtained at two different overpotentials in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. Amethod for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed.

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