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The measurements of surface tension, density and viscosity of liquid Sn-Zn  eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were  carried out using the sessile drop method, dilatometric technique and  capillary method. The measurements were performed at temperature range  between 493 and 843 K. The technique of sessile drop was applied in the  measurements of wetting angles and spreading test in the SnZnIn/ Cu system.  Surface tension, density and viscosity measurements were carried out in a  protective argon-hydrogen atmosphere. Wettability tests were performed in air  in the presence of flux Alu33, at 250°C for 2 minutes. Subsequently, the  microstructure of solder and the resulting joints was studied. The addition  of In to eutectic Sn-Zn alloy improved the wetting properties and causes a  reduction of thickness of the intermetallic compounds layer created at the  interface between the liquid solder and the Cu substrate.

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system