Thermal and electro-thermal modeling of components and systems: A review of the research at the University of Parma | Zendy

R. Menozzi | Zendy; P. Cova | Zendy; Nicola Delmonte | Zendy; F. Giuliani | Zendy; Giovanna Sozzi | Zendy

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Thermal and electro-thermal modeling of components and systems: A review of the research at the University of Parma

Author(s) -

R. Menozzi,

P. Cova,

Nicola Delmonte,

F. Giuliani,

Giovanna Sozzi

Publication year - 2015

Publication title -

facta universitatis - series electronics and energetics

Language(s) - English

Resource type - Journals

eISSN - 2217-5997

pISSN - 0353-3670

DOI - 10.2298/fuee1503325m

Subject(s) - thermal , heat sink , finite element method , ranging , mechanical engineering , electronic circuit , hierarchy , thermal analysis , field (mathematics) , engineering physics , materials science , engineering , electrical engineering , structural engineering , physics , telecommunications , thermodynamics , mathematics , economics , pure mathematics , market economy

This paper reviews the activity carried out at the Department of Information Engineering of the University of Parma, Italy, in the field of thermal and electro-thermal modeling of devices, device and package assemblies, circuits, and systems encompassing active boards and heat-sinking elements. This activity includes: (i) Finite-Element 3D simulation for the thermal analysis of a hierarchy of structures ranging from bare device dies to complex systems including active and passive devices, boards, metallizations, and air- and water-cooled heat-sinks, and (ii) Lumped-Element thermal or electro-thermal models of bare and packaged devices, ranging from purely empirical to strictly physics- and geometry-based.

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