Thermal stress analysis of electronic packaging | Zendy

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Thermal stress analysis of electronic packaging

Author(s) -

Victor Aldea

Publication year - 2004

Language(s) - Uncategorized

Resource type - Dissertations/theses

DOI - 10.22215/etd/2004-05968

Subject(s) - stress (linguistics) , materials science , electronic packaging , structural engineering , composite material , engineering , philosophy , linguistics

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