Thermal stress analysis of electronic packaging | Zendy

AI Assistant Blog Pricing

Open Access

Thermal stress analysis of electronic packaging

Author(s) -

Victor Aldea

Publication year - 2018

Language(s) - Uncategorized

Resource type - Dissertations/theses

DOI - 10.22215/etd/2004-05968

Subject(s) - stress (linguistics) , electronic packaging , materials science , mechanical engineering , engineering , composite material , philosophy , linguistics

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Empowering knowledge with every search

About

About Careers Publisher Partners Contact Us

Learn

FAQs Blog Terms of Use Privacy Policy

Discover

Explore

Copyright Knowledge E © 2025. All Rights Reserved.