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Data summary for nominal 500 ?m DUO<sub>2</sub> Kernels
Author(s) -
John D. Hunn
Publication year - 2004
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/974587
Subject(s) - composite number , electroforming , materials science , nuclear engineering , composite material , engineering , layer (electronics)

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