Open AccessMold Heating and Cooling Pump Package Operator Interface Controls Upgrade
Author(s) -
Josh A. Salmond
Publication year - 2009
Language(s) - English
Resource type - Reports
DOI - 10.2172/972913
Subject(s) - mold , interface (matter) , mechanical engineering , software , temperature control , upgrade , process (computing) , computer science , engineering , materials science , composite material , operating system , bubble , maximum bubble pressure method
The modernization of the Mold Heating and Cooling Pump Package Operator Interface (MHC PP OI) consisted of upgrading the antiquated single board computer with a proprietary operating system to off-the-shelf hardware and off-the-shelf software with customizable software options. The pump package is the machine interface between a central heating and cooling system that pumps heat transfer fluid through an injection or compression mold base on a local plastic molding machine. The operator interface provides the intelligent means of controlling this pumping process. Strict temperature control of a mold allows the production of high quality parts with tight tolerances and low residual stresses. The products fabricated are used on multiple programs