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Telemetry engineering and fabrication alternative soldering techniques for CFC elimination
Author(s) -
Rick Howard
Publication year - 1995
Language(s) - English
Resource type - Reports
DOI - 10.2172/95263
Subject(s) - reflow soldering , soldering , fabrication , process (computing) , convection , engineering , computer science , materials science , mechanical engineering , meteorology , metallurgy , operating system , physics , medicine , alternative medicine , pathology
In an effort to eliminate the need for chlorinated fluorocarbons (CFCs) for several production assemblies in Telemetry Engineering and Fabrication, an alternate soldering reflow process to replace the current vapor phase system was needed. After analyzing IR, convection, and recovery vapor phase soldering reflow methods, it was discovered that an improved process would result from the implementation of a new convection reflow system. The convection oven reflow method was evaluated by collecting data from visual inspections, shear, push, and cross-section tests on several surface mount devices

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