Open AccessDesign of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects
Author(s) -
Larry A. Wolfe
Publication year - 2009
Language(s) - English
Resource type - Reports
DOI - 10.2172/952623
Subject(s) - lamination , soldering , delamination (geology) , materials science , composite material , metallurgy , mechanical engineering , engineering , layer (electronics) , geology , paleontology , subduction , tectonics
Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup