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Conveyorized Photoresist Stripping Replacement for Flex Circuit Fabrication
Author(s) -
Megan Donahue
Publication year - 2009
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/952451
Subject(s) - photoresist , stripping (fiber) , fabrication , flex , potassium hydroxide , materials science , chemistry , nanotechnology , computer science , composite material , telecommunications , organic chemistry , medicine , alternative medicine , layer (electronics) , pathology
A replacement conveyorized photoresist stripping system was characterized to replace the ASI photoresist stripping system. This system uses the qualified ADF-25c chemistry for the fabrication of flex circuits, while the ASI uses the qualified potassium hydroxide chemistry. The stripping process removes photoresist, which is used to protect the copper traces being formed during the etch process

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