Open AccessInvestigations into High Temperature Components and Packaging
Author(s) -
Laura D. Marlino,
Larry E. Seiber,
M.B. Scudiere,
Madhu Chinthavali,
F. Patrick McCluskey
Publication year - 2007
Language(s) - English
Resource type - Reports
DOI - 10.2172/932634
Subject(s) - silicon carbide , junction temperature , reliability (semiconductor) , electronics , bipolar junction transistor , operating temperature , capacitor , materials science , radiator (engine cooling) , automotive engineering , electronic component , temperature measurement , electrical engineering , component (thermodynamics) , mechanical engineering , transistor , power (physics) , engineering , voltage , composite material , physics , quantum mechanics , thermodynamics