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Mechanics and tribology of MEMS materials.
Author(s) -
Somuri V. Prasad,
M. Dugger,
Brad Boyce,
Thomas Edward Buchheit
Publication year - 2004
Language(s) - English
Resource type - Reports
DOI - 10.2172/918765
Subject(s) - microscale chemistry , tribology , microelectromechanical systems , microsystem , flexibility (engineering) , materials science , mechanical engineering , nanotechnology , liga , electroplating , nanoscopic scale , engineering , fabrication , layer (electronics) , medicine , statistics , mathematics education , mathematics , alternative medicine , pathology
Micromachines have the potential to significantly impact future weapon component designs as well as other defense, industrial, and consumer product applications. For both electroplated (LIGA) and surface micromachined (SMM) structural elements, the influence of processing on structure, and the resultant effects on material properties are not well understood. The behavior of dynamic interfaces in present as-fabricated microsystem materials is inadequate for most applications and the fundamental relationships between processing conditions and tribological behavior in these systems are not clearly defined. We intend to develop a basic understanding of deformation, fracture, and surface interactions responsible for friction and wear of microelectromechanical system (MEMS) materials. This will enable needed design flexibility for these devices, as well as strengthen our understanding of material behavior at the nanoscale. The goal of this project is to develop new capabilities for sub-microscale mechanical and tribological measurements, and to exercise these capabilities to investigate material behavior at this size scale

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