Open AccessFinal Progress Report: FRACTURE AND SUBCRITICAL DEBONDING IN THIN LAYERED STRUCTURES: EXPERIMENTS AND MULTI-SCALE MODELING
Author(s) -
Reinhold H. Dauskardt
Publication year - 2005
Language(s) - English
Resource type - Reports
DOI - 10.2172/877945
Subject(s) - materials science , cracking , fracture (geology) , ceramic , composite material , microelectromechanical systems , reliability (semiconductor) , thin film , fracture mechanics , silicon , nanoscopic scale , fatigue cracking , nanotechnology , metallurgy , power (physics) , physics , quantum mechanics
Final technical report detailing unique experimental and multi-scale computational modeling capabilities developed to study fracture and subcritical cracking in thin-film structures. Our program to date at Stanford has studied the mechanisms of fracture and fatigue crack-growth in structural ceramics at high temperature, bulk and thin-film glasses in selected moist environments where we demonstrated the presence of a true mechanical fatigue effect in some glass compositions. We also reported on the effects of complex environments and fatigue loading on subcritical cracking that effects the reliability of MEMS and other micro-devices using novel micro-machined silicon specimens and nanomaterial layers