Open AccessReduction of Resistivity in Cu Thin Films by Partial Oxidation: Microstructural Mechanisms
Author(s) -
W Prater
Publication year - 2003
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/826466
Subject(s) - electrical resistivity and conductivity , materials science , thin film , microstructure , copper , oxide , oxygen , grain size , sputtering , electrical resistance and conductance , analytical chemistry (journal) , copper oxide , metallurgy , mineralogy , composite material , nanotechnology , chemistry , engineering , organic chemistry , chromatography , electrical engineering
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