Open AccessCH Packaging Operations Manual
Author(s) -
Washington Tru Solutions
Publication year - 2002
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/814952
Subject(s) - computer science
- This procedure provides instructions for assembling the following CH packaging payload: - Drum payload assembly - Standard Waste Box (SWB) assembly - Ten-Drum Overpack (TDOP)