GaAs MOEMS Technology
Author(s) -
Olga B. Spahn,
GRANT GROSSETETE,
Michael Joseph Cich,
C.P. Tigges,
John M. Reno,
GREGORY PEAKE,
John F. Klem,
J.J. Lean,
CHARLES FULLER,
J. Burkhart,
Thomas Bauer,
Charles R. Sullivan
Publication year - 2003
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/809616
Subject(s) - microsystem , microelectromechanical systems , component (thermodynamics) , materials science , actuator , microfabrication , electronic component , electronics , coating , optoelectronics , nanotechnology , electronic engineering , computer science , mechanical engineering , electrical engineering , engineering , physics , medicine , alternative medicine , pathology , fabrication , thermodynamics
Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vital step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated
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