Thin film adhesion by nanoindentation-induced superlayers. Final report | Zendy

W. W. Gerberich | Zendy; Alex A. Volinsky | Zendy

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Thin film adhesion by nanoindentation-induced superlayers. Final report

Author(s) -

W. W. Gerberich,

Alex A. Volinsky

Publication year - 2001

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/809372

Subject(s) - nanoindentation , materials science , indentation , adhesion , composite material , residual stress , thin film , radius , delamination (geology) , toughness , nanotechnology , computer science , paleontology , computer security , biology , subduction , tectonics

This work has analyzed the key variables of indentation tip radius, contact radius, delamination radius, residual stress and superlayer/film/interlayer properties on nanoindentation measurements of adhesion. The goal to connect practical works of adhesion for very thin films to true works of adhesion has been achieved. A review of this work titled ''Interfacial toughness measurements of thin metal films,'' which has been submitted to Acta Materialia, is included

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