Solid state device for two-wire downhole temperature measurement as a function of current. Final performance technical report | Zendy

Roger E. Anderson | Zendy; David E. Anderson | Zendy

Open Access

Solid state device for two-wire downhole temperature measurement as a function of current. Final performance technical report

Author(s) -

Roger E. Anderson,

David E. Anderson

Publication year - 2002

Language(s) - English

Resource type - Reports

DOI - 10.2172/798495

Subject(s) - platinum , resistive touchscreen , materials science , copper , layer (electronics) , plating (geology) , ceramic , coating , metallurgy , copper wire , composite material , electrical engineering , chemistry , engineering , biochemistry , geophysics , geology , catalysis

Several metals systems were reviewed for their potential to act as resistive temperature devices. Platinum metal was selected as the metal of choice. Platinum was plated onto 5 mil copper wire, and then subsequently coated with Accusol's proprietary ceramic coating. The copper was etched out in an attempt to make a pure platinum, high resistive, resistive-temperature device. The platinum plating on the wire cracked during processing, resulting in a discontinuous layer of platinum, and the element could not be formed in this way

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