Pulsed Dielectric Breakdown of Aluminum Oxide (ALOX) Filled Epoxy Encapsulants: Effects of Formulation and Electric Stress Concentration

Aluminum oxide (ALOX) filled epoxy is the dielectric encapsulant in shock driven high-voltage power supplies. ALOX encapsulants display a high dielectric strength under purely electrical stress, but minimal information is available on the combined effects of high voltage and mechanical shock. We report breakdown results from applying electrical stress in the form of a unipolar high-voltage pulse of the order of 10-{micro}s duration, and our findings may establish a basis for understanding the results from proposed combined-stress experiments. A test specimen geometry giving approximately uniform fields is used to compare three ALOX encapsulant formulations, which include the new-baseline 459 epoxy resin encapsulant and a variant in which the Alcoa T-64 alumina filler is replaced with Sumitomo AA-10 alumina. None of these encapsulants show a sensitivity to ionizing radiation. We also report results from specimens with sharp-edged electrodes that cause strong, localized field enhancement as might be present near electrically-discharged mechanical fractures in an encapsulant. Under these conditions the 459-epoxy ALOX encapsulant displays approximately 40% lower dielectric strength than the older Z-cured Epon 828 formulation. An investigation of several processing variables did not reveal an explanation for this reduced performance. The 459-epoxy encapsulant appears to suffer electrical breakdown if the peak field anywhere reaches a critical level. The stress-strain characteristics of Z-cured ALOX encapsulant are measured under high triaxial pressure and we find that this stress causes permanent deformation and a network of microscopic fractures. Recommendations are made for future experimental work