Life cycle cost study for coated conductor manufacture by metal organic chemical vapor deposition
Author(s) -
J. N. Chapman
Publication year - 1999
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/775041
Subject(s) - capital cost , process engineering , metalorganic vapour phase epitaxy , chemical vapor deposition , deposition (geology) , metal , boiling point , process (computing) , materials science , chemistry , computer science , nanotechnology , electrical engineering , engineering , organic chemistry , metallurgy , paleontology , epitaxy , layer (electronics) , sediment , biology , operating system
The purpose of this report is to calculate the cost of producing high temperature superconducting wire by the Metal Organic Chemical Vapor Deposition (MOCVD) process. The technology status is reviewed from the literature and a plant conceptual design is assumed for the cost calculation. The critical issues discussed are the high cost of the metal organic precursors, the material utilization efficiency and the capability of the final product as measured by the critical current density achieved. Capital, operating and material costs are estimated and summed as the basis for calculating the cost per unit length of wire. Sensitivity analyses of key assumptions are examined to determine their effects on the final wire cost. Additionally, the cost of wire on the basis of cost per kiloampere per meter is calculated for operation at lower temperatures than the liquid nitrogen boiling temperature. It is concluded that this process should not be ruled out on the basis of high cost of precursors alone
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