Ultrasonic evaluation of beryllium-copper diffusion bonds | Zendy

E.E. Jamieson | Zendy

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Ultrasonic evaluation of beryllium-copper diffusion bonds

Author(s) -

E.E. Jamieson

Publication year - 2000

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/756292

Subject(s) - beryllium , copper , bond strength , materials science , reflection (computer programming) , diffusion , ultrasonic sensor , diffusion bonding , bond , composite material , acoustics , chemistry , metallurgy , thermodynamics , layer (electronics) , adhesive , physics , organic chemistry , finance , computer science , economics , programming language

A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths

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