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UTSI/CFFF MHD program completion and related activity
Author(s) -
J. W. Muehlhauser,
J.N. Chapman
Publication year - 1999
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/754429
Subject(s) - dispose pattern , process engineering , annealing (glass) , materials science , work function , environmental remediation , mechanical engineering , waste management , metallurgy , engineering , nanotechnology , layer (electronics) , ecology , contamination , biology
Maintenance work on the DOE CFFF facility and other related government property remained in suspension in accordance with the stop work order issued by DOE. Environmental remediation and preservation of the facility continued. Final actions were completed to dispose of the soil that was contaminated by diesel oil. Actions are underway to dispose of other wastes. Progress is reported on the 5 high temperature superconductivity projects under Task 6. Results are reported for various techniques for annealing cold rolled nickel tapes and applying buffer layer by the Sol-Gel process. Included in the annealing/coating work is one case that involved oxidizing the nickel to nickel oxide which is textured before application of the buffer layer. Work under the Optimum Coated Conductor included issuing a topical report describing the work on grain boundary grooving in nickel substrates as a function of annealing temperature and time. Also, the work to evaluate the mutual effects of adjacent superconductors. In the cost/performance analysis project, completion of a study on the economics of production of coated conductors by the MOCVD process is reported. In the diagnostics for real time process control project, a topical report that outlines the requirements for control of promising manufacturing processes was submitted, additional work is reported on using absorption spectroscopy as the basis for control of the stoichiometry for the MOCVD process and the work on scatterometry for measuring uniformity of surfaces is summarized

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